Document Type
Thesis - University Access Only
Award Date
1994
Degree Name
Master of Science (MS)
Department / School
Civil Engineering
First Advisor
Delvin E. DeBoer
Abstract
This study is part of a larger study performed to help a printed circuit board facility resolve wastewater treatment problems. The existing chemical precipitation treatment system was operating at full capacity and generating a large amount of hazardous sludge. One of the major concerns of the manufacturer was the high cost of disposing the hazardous sludge. Before any treatment alternatives could be evaluated, an understanding of the wastewater characteristics was required. This was achieved by sampling various sources of wastewater and determining their flow contributions to the composite wastewater. Copper was the major metal of concern in the waste streams and was strictly regulated by local authorities. Major sources of copper were from the spray rinses following the electroless and acid copper plating processes. These low-volume spray rinses contained high copper concentrations. Therefore, segregating the spray rinses from the other waste streams and treating the low volume spray rinses separately were suggested. Following a survey of treatment techniques, ion exchange and electrolytic recovery were selected and evaluated for treating the spray rinses. Bench scale units of these processes were constructed and used to treat the spray rinses. The results indicate that these processes are capable of treating the spray rinses.
Library of Congress Subject Headings
Printed circuits industry -- Waste disposal
Sewage -- Purification
Format
application/pdf
Publisher
South Dakota State University
Recommended Citation
Chew, Chin Fei, "Printed Circuit Board Process Wastewater Characterization and Treatment" (1994). Electronic Theses and Dissertations. 89.
https://openprairie.sdstate.edu/etd2/89
Rights Statement
