Author

Chin Fei Chew

Document Type

Thesis - University Access Only

Award Date

1994

Degree Name

Master of Science (MS)

Department / School

Civil Engineering

First Advisor

Delvin E. DeBoer

Abstract

This study is part of a larger study performed to help a printed circuit board facility resolve wastewater treatment problems. The existing chemical precipitation treatment system was operating at full capacity and generating a large amount of hazardous sludge. One of the major concerns of the manufacturer was the high cost of disposing the hazardous sludge. Before any treatment alternatives could be evaluated, an understanding of the wastewater characteristics was required. This was achieved by sampling various sources of wastewater and determining their flow contributions to the composite wastewater. Copper was the major metal of concern in the waste streams and was strictly regulated by local authorities. Major sources of copper were from the spray rinses following the electroless and acid copper plating processes. These low-volume spray rinses contained high copper concentrations. Therefore, segregating the spray rinses from the other waste streams and treating the low volume spray rinses separately were suggested. Following a survey of treatment techniques, ion exchange and electrolytic recovery were selected and evaluated for treating the spray rinses. Bench scale units of these processes were constructed and used to treat the spray rinses. The results indicate that these processes are capable of treating the spray rinses.

Library of Congress Subject Headings

Printed circuits industry -- Waste disposal
Sewage -- Purification

Format

application/pdf

Publisher

South Dakota State University

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Rights Statement

In Copyright